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| Advance Product Information November 7, 2005 6.5 Watt Ku Band Power Amplifier Key Features * * * * * * * * TGA2514-FL TGA2514-FL DATE CODE LOT CODE Frequency Range: 13 - 16 GHz 38 dBm Nominal Psat 24 dB Nominal Gain 14 dB Nominal Return Loss 0.25-um pHEMT 3MI Technology 10 lead flange package Bias Conditions: 8 V @ 2.6 A Idq Package dimension: 0.45 x 0.68 x 0.12 in. Primary Applications Product Description The TGA2514-FL provides 24 dB of gain and 6.5W of output power across 13-16 GHz. The TGA2514-FL is designed using TriQuint's proven standard 0.25-m gate pHEMT production process. This device is ideally suited for VSAT Transmitter and Point to Point Radio applications. The flange lead package has a high thermal conductivity copper alloy base. Lead-Free & RoHS compliant Evaluation Boards are available. Gain (dB) * * Ku band VSAT Transmitter Point to Point Radio Measured Data Bias Conditions: Vd = 8 V, Idq = 2.6A 40 39 38 Psat (dBm) 37 36 35 34 33 32 31 30 13 14 15 16 17 18 19 20 Frequency (GHz) 28 24 20 16 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 9 11 13 28 24 20 16 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 19 21 23 Gain Output Input 15 17 Frequency (GHz) Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. 1 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Return Loss (dB) Advance Product Information TABLE I MAXIMUM RATINGS Symbol V+ VI+ | IG | PIN PD TCH TM TSTG 1/ 2/ 3/ 4/ Parameter 1/ Positive Supply Voltage Negative Supply Voltage Range Positive Supply Current Gate Supply Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (30 Seconds) Storage Temperature Value 9V -5V TO -0.35V 4A 113 mA 30.3 dBm 20.8 W 150 0C 210 0C -65 to 150 0C 2/ 2/, 3/ 4/ 2/ November 7, 2005 TGA2514-FL Notes 2/ These ratings represent the maximum operable values for this device. Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. When operated at this bias condition with a base plate temperature of 70 0C, the median life is 1E+6 hours. Junction operating temperature will directly affect the device median time to failure (TM). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. 2 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 7, 2005 TGA2514-FL TABLE II RF CHARACTERIZATION TABLE (TA = 25qC, Nominal) (Vd = 8V, Id = 2.6 A) SYMBOL PARAMETER TEST CONDITION f = 13-16 GHz TYPICAL UNITS Gain Small Signal Gain 24 dB IRL Input Return Loss f = 13-16 GHz 14 dB ORL Output Return Loss f = 13-16 GHz 14 dB Psat Saturated Power f = 13-16 GHz 38 dBm TABLE III THERMAL INFORMATION Parameter RJC Thermal Resistance (channel to backside of package) Test Conditions Vd = 8 V ID = 2.6 A (Quiescent) Pdiss = 20.8 W TCH (oC) 150 RTJC (qC/W) 3.9 TM (HRS) 1 E+6 Note: Package backside SnPb soldered to carrier at 70C baseplate temperature. At saturated output power, the DC power consumption is 28.8 W with 6.5 W RF power delivered to the load. Power dissipated is 22.3 W and the temperature rise in the channel is 87 C. The baseplate temperature must be reduced to 63C to remain below the 150 C maximum channel temperature. 3 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 7, 2005 TGA2514-FL Measured Fixture Data Bias Conditions: Vd = 8 V, Idq = 2.6A 28 24 20 16 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 9 11 13 Gain Output Input 28 24 20 16 12 8 4 0 -4 -8 -12 -16 -20 -24 -28 19 21 23 15 17 Frequency (GHz) 40 39 38 Psat (dBm) 37 36 35 34 33 32 31 30 13 14 15 16 17 18 19 20 Frequency (GHz) Return Loss (dB) 4 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Gain (dB) Advance Product Information November 7, 2005 TGA2514-FL Measured Fixture Data Bias Conditions: Vd = 8 V, Idq = 2.6A 4.5 4 3.5 Id (A) 3 2.5 2 1.5 13.5G H z 14G H z 14.5G H z 15G H z 9 10 11 12 13 14 15 16 17 18 19 20 21 22 P in (d B m ) 40 38 Pout (dBm) 36 13.5GHz 14GHz 14.5GHz 34 32 15GHz 30 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Pin (dBm) 25 23 Power Gain (dB) 21 13.5GHz 14GHz 14.5GHz 19 17 15GHz 15 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Pin (dBm) 5 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 7, 2005 TGA2514-FL Measured Fixture Data Bias Conditions: Vd = 8 V, Idq = 2.6A 30 25 20 S21 (dB) 15 10 5 0 -5 -10 8 10 12 14 16 18 20 22 Frequency (GHz) 75 degC -40 degC 25 degC 39 38.5 P1dB (dBm) 38 37.5 37 36.5 36 35.5 13 13.5 14 14.5 15 15.5 16 16.5 Frequency (GHz) 25 degC -40 degC 75 degC 6 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 7, 2005 TGA2514-FL Evaluation Board Notes: 1. Vd must remain below 9V to comply with maximum rating value. 2. The drain supply must be connected to both sides of the evaluation block. 3. The cooling fan must be powered at all times when the device is under bias. 4. Connect fan supply red/black to +12V. It requires ~100mA. 7 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 7, 2005 TGA2514-FL Assembly Diagram Vd Vd 1 PF 0.01PF 6 RF In 3 10 8 RF Out 0.01 PF 1 PF TGA2514-FL Gnd 2,4,7 1 5 10 : Vg 1 PF 0.01 PF 10 : Vg 1 PF 0.01 PF Note: Vg can be biased from either Pin 1 or Pin 5 8 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 7, 2005 TGA2514-FL Mechanical Drawing TGA2514-FL N/C Note: All dimensions are in inches with 0.005 tolerance 9 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com Advance Product Information November 7, 2005 TGA2514-FL Assembly of a TGA2514-FL Package onto a Motherboard 1. Clean the motherboard or module with acetone. Rinse with alcohol and DI water. Allow the circuit to fully dry. 2. To improve the thermal and RF performance, we recommend a heat sink attached to the bottom of the package and apply Indium alloy shim ( 80IN,15PB and 5AG. Part # IPN 10061) to the bottom of TGA2514-FL. 3. Apply solder to each pin of TGA2514-FL. 4 Clean the assembly with alcohol. . Ordering Information Part TGA2514-FL Package Style Flange (package bolted down) 10 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com |
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